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In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2009. Timing yield-aware color reassignment and detailed placement perturbation for bimodal cd distribution in double patterning lithography. Characterization and decomposition of self-aligned quadruple patterning friendly layout. Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Anaheim, 2010. The resulting design, called the “EnviZion” diaphragm valve, appears to completely change the performance, reliability and quality impact of this component and boasts the following claim: The purpose of this course is to augment the mechanical design process with a body of knowledge concerning the manufacturing aspects as related to design. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. Layout decomposition for quadruple patterning lithography and beyond. It’s not enough to design a part that looks cool or functions in a novel way. A systematic framework for evaluating cell level middle-of-line (MOL) robustness for multiple patterning. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2006. Learn more about Institutional subscriptions, Moore G E. Lithography and the future of Moore’s law. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Proc SPIE, 2005, 5751, Kahng A B, Xu X, Zelikovsky A. Yield-and cost-driven fracturing for variable shaped-beam mask writing. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2008. Pattern split rules! 186–193, Xiao Z G, Du Y L, Wong M D F, et al. of Electrical and Computer Engineering 47–52, Gupta M, Jeong K, Kahng A B. Self-aligned double and quadruple patterning-aware grid routing with hotspots control. All components have some tolerance ratings; these are usually specified as absolute percentages, or as deviations from a nominal value. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. Springer, 2015, Reis R, Cao Y, Wirth G. Circuit Design for Reliability. 178–185, Tian H T, Zhang H B, Xiao Z G, et al. OBJECTIVES. Proc SPIE, 2011: 7973, Sahouria E, Bowhill A. Generalization of shot definition for variable shaped e-beam machines for write time reduction. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. A fuzzy-matching model with grid reduction for lithography hotspot detection. 63–66, Lin Y-H, Li Y-L. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. New insights into the design for end-of-life variability of NBTI in scaled high-κ/metal-gate technology for the nano-reliability era. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. 47–52, Vattikonda R, Wang W P, Cao Y. A unified perspective of RTN and BTI. Effective product development must go beyond the traditional steps of acquiring and implementing product and process design technology as the solution. J Micro/Nanolithogr MEMS MOEMS, 2015, 14: 011003, Matsunawa T, Gao J-R, Yu B, et al. The difference between the best thermally optimal design and the best manufacturable design represents the “manufacturability gap” [4, 5]. 161: 6, Ebrahimi M, Liang C, Asadi H, et al. Towards the systematic study of aging induced dynamic variability in nano-MOSFETs: adding the missing cycle-to-cycle variation effects into device-to-device variation. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. China Inf. The paradigm shift in understanding the bias temperature instability: from reaction–diffusion to switching oxide traps. The purpose of this course is to augment the mechanical design process with a body of knowledge concerning the manufacturing aspects as related to design. Design for Manufacturability The success of a product’s development and production begins with the design. IEEE Trans Electron Dev, 2013, 60: 1716–1722, Grasser T, Kaczer B, Goes W, et al. Achieving high-yielding designs, in the state of the art VLSI technology has become an extremely challenging task due to the miniaturization as well as the complexity of leading-edge products. PARR: pin access planning and regular routing for self-aligned double patterning. Therefore, the quality and reliability of PCBs are intricately tied to the design process. 83–86, Fang S-Y, Hong Y-X, Lu Y-Z. A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. 1–8, Yu B, Pan D Z. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Salt Lake City, 2012. 27–34, Chen T C, Cho M, Pan D Z, et al. IEEE Trans Very Large Scale Integr Syst, 2015, 23: 1628–1639, Sheng W G, Xiao L Y, Mao Z G. Soft error optimization of standard cell circuits based on gate sizing and multiobjective genetic algorithm. IEEE Trans Comput Aided Des Integr Circ Syst, 2008, 27: 2145–2155, Shim S, Lee Y, Shin Y. Lithographic defect aware placement using compact standard cells without inter-cell margin. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. 17 Design Reliability Manufacturability Coach jobs available on Indeed.com. Mentor Graphics White Paper, 2013, Selim M. Circuit aging tools and reliability verification. 506–511, Yuan K, Lu K, and Pan D Z. 186–191, Liu C-Y, Chang Y-W. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2012. 89: 6, Kiamehr S, Osiecki T, Tahoori M B, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. Proc SPIE, 2006, 6283, Ma X, Jiang S L, Zakhor A. IEEE Trans Electron Dev, 2011, 58: 3652–3666, Wang R S, Huang R, Kim D-W, et al. 591–596, Lin Y-H, Yu B, Pan D Z, et al. 544–549, Posser G, Mishra V, Jain O, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. One of the biggest factors is the manufacturability … 839–846, Yu Y-T, Chan Y-C, Sinha S, et al. 390–395, Liu Z Q, Liu C W, Young E F Y. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. Reliability aware gate sizing combating NBTI and oxide breakdown. Manufacturability is in many ways dictated by a part’s design, and can have huge implications as to the cost and effectiveness of the end product. PBTI-associated high-temperature hot carrier degradation of nMOSFETs with metal-gate/high-k dielectrics. Block copolymer directed self-assembly (DSA) aware contact layer optimization for 10 nm 1D standard cell library. DfM can reduce many reliability costs, since products can be quickly assembled from fewer parts. Triple patterning aware detailed placement with constrained pattern assignment. Self-aligned double patterning decomposition for overlay minimization and hot spot detection. Science China Information Sciences 404–409, Du Y L, Wong M D F. Optimization of standard cell based detailed placement for 16 nm FinFET process. SAMURAI: an accurate method for modelling and simulating nonstationary random telegraph noise in SRAMs. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. Sci. Formulating the electrical behavior of a design in terms of probability distributions on its tolerances is a … In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. 208–213, Chien H-A, Han S-Y, Chen Y-H, et al. David Z. Pan. Every production technology has its own specific design guideline that needs to be consulted depending on the situation. Correspondence to 299–302, Li D-A, Marek-Sadowska M, Nassif S R. A method for improving power grid resilience to electromigration-caused via failures. Phone: 949.458.9477 As an FDA-regulated medical technology company making devices for direct consumer use, our product had some unique challenges in regard to reliability, manufacturability, and cost. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2007. A new lithography hotspot detection framework based on AdaBoost classifier and simplified feature extraction. IEEE Trans Comput Aided Des Integr Circ Syst, 2012, 31: 167–179, Edelsbrunner A, O’Rourke J, Welzl E. Stationing guards in rectilinear art galleries. This guarantees reliable, repeatable performance for WiSpry’s devices in wireless applications and beyond. J Appl Phys, 1999, 86: 3068–3075, Pak J, Lim S K, Pan D Z. Electromigration study for multiscale power/ground vias in TSV-based 3-D ICs. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2009. Predicting variability in nanoscale lithography processes. 70: 6, Pain L, Jurdit M, Todeschini J, et al. Design for Manufacturability (DFM) is a system approach that simultaneously considers all of the design goals and constraints for products that will be manufactured. DSA template mask determination and cut redistribution for advanced 1D gridded design. DFM Design for Manufacturability Valor Trilogy Valor NPI service 24 to 48 hours turn component coverage limited to current Valor library (30+ million parts) footprint design reduce assembly rework and enhances long term reliability DFM&R75 Proc SPIE, 2003, 5256, Roseboom E, Rossman M, Chang F-C, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. Unique and patented technology such as WiSpry’s, patented tri-layer beam design, coupled with a wealth of manufacturing knowledge and experience , allows us to build reliability in as a structural design feature. EPIC: efficient prediction of IC manufacturing hotspots with a unified meta-classification formulation. Proc SPIE, 2012: 8326, Kang W L, Feng C, Chen Y. Minsik Cho ; Dept. 357: 6, Fang S-Y, Liu I-J, Chang Y-W. Stitch-aware routing for multiple e-beam lithography. Methodology for standard cell compliance and detailed placement for triple patterning lithography. 453–460, Ye W, Yu B, Ban Y-C, et al. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Austin, 2007. T186–T187, Luo M, Wang R Q, Guo S N, et al. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. Accurate lithography hotspot detection based on principal component analysis-support vector machine classifier with hierarchical data clustering. 61–68, Oboril F, Tahoori M B. ExtraTime: modeling and analysis of wearout due to transistor aging at microarchitecturelevel. In: Proceedings of IEEE International Conference on Computer Design (ICCD), New York, 2015. Lead-free solders present different physical properties compared with the conventional tin–lead solders. In addition, predictable development time, efficient manufacturing with high yields, and exemplary IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 939–952, Yuan K, Yang J-S, Pan D Z. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. 1641–1646, Gillijns W, Sherazi S M Y, Trivkovic D, et al. Physics-based electromigration assessment for power grid networks. Deep understanding of AC RTN in MuGFETs through new characterization method and impacts on logic circuits. IEEE J Emerg Sel Top Circ Syst, 2011, 1: 50–58, Mallik A, Zuber P, Liu T T, et al. 1047–1052, Wu K-C, Marculescu D. Joint logic restructuring and pin reordering against NBTI-induced performance degradation. 601–606, Xu Y, Chu C. A matching based decomposer for double patterning lithography. http://www.synopsys.com, Calibre pattern matching. New observations on the hot carrier and NBTI reliability of silicon nanowire transistors. 28: 6, Yang J-S and Pan D Z. Overlay aware interconnect and timing variation modeling for double patterning technology. An efficient layout decomposition approach for triple patterning lithography. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 1671–1680, Ding D, Wu X, Ghosh J, et al. Springer, 2014, Maricau E, Gielen G. Computer-aided analog circuit design for reliability in nanometer CMOS. Tax calculation will be finalised during checkout. o Reliabilityis the measure of a product’s ability to o …perform the specified function o …at the customer (with their use environment) o …over the desired lifetime o Design for Reliabilityis a process for ensuring the reliability of a product or system during the design stage before physical prototype By incorporating manufacturability concepts into the design process it is feasible to avoid downstream problems in the manufacturing arena. 263–270, Yu Y-T, Lin G-H, Jiang I H-R, et al. 396–401, Ding Y X, Chu C, Mak W-K. 488–493, van Oosten A, Nikolsky P, Huckabay J, et al. By Jamil Kawa, R&D Group Director, Synopsys, Inc. Introduction. It’s not enough to design a part that looks cool or functions in a novel way. Accurate process-hotspot detection using critical design rule extraction. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. Pattern sensitive placement for manufacturability. Aging-aware logic synthesis. 389–391, Ebrahimi M, Oboril F, Kiamehr S, et al. Proc SPIE, 2007, 6521, Kahng A B, Park C-H, Xu X. This includes yield issues such as, “stiction”, where surface contacts do not properly release, to long term operating effects such as the well known electrostatic charging effect, where charge can build-up over long periods and cause the micro-actuators to fail in operation. Microelectron Reliab, 2010, 50: 775–789, Sarychev M E, Zhitnikov Y V, Borucki L, et al. New insights into AC RTN in scaled high-k/metal-gate MOSFETs under digital circuit operations. New York: Springer Science & Business Media, 2013, Liu C Z, Zou J B, Wang R S, et al. It is therefore critical that companies have a design for manufacturability (DfM) protocol in place to mitigate these problems. Self-aligned double patterning friendly configuration for standard cell library considering placement. Subscribe to DesignWare Technical Bulletin. On refining row-based detailed placement for triple patterning lithography. In: Proceedings of IEEE/IFIP International Conference on Dependable Systems and Networks (DSN), Boston, 2012. 267–272, Du Y L, Ma Q, Song H, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. In: Proceedings of 19th Asia and South Pacific Design Automation Conference (ASPDAC), Singapore, 2014. Contact-hole patterning for random logic circuit using block copolymer directed self-assembly. Efficient process-hotspot detection using range pattern matching. 38–43, Chakraborty A, Pan D Z. © 2020 Springer Nature Switzerland AG. A cell-based row-structure layout decomposer for triple patterning lithography. Design For Reliability Manufacturability Handbook full free pdf books In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. Parts are designed for ease of … IEEE Trans Circ Syst II, 2011, 58: 512–516, Campbell K A, Vissa P, Pan D Z, et al. Triple patterning lithography aware optimization for standard cell based design. A polynomial time triple patterning algorithm for cell based row-structure layout. Triple patterning aware detailed placement toward zero cross-row middle-of-line conflict. In fact, every board that is manufactured has to first be designed. 370–375, Yang X, Saluja K. Combating NBTI degradation via gate sizing. High performance lithography hotspot detection with successively refined pattern identifications and machine learning. In: Proceedings of IEEE International Conference on IC Design and Technology (ICICDT), Austin, 2009. 57–64, Tian H T, Du Y L, Zhang H B, et al. Design for manufacturability and reliability in extreme-scaling VLSI. IEEE Trans Depend Secur Comput, 2012, 9: 770–776, Jiang I H-R, Chang H-Y, Chang C-L. WiT: optimal wiring topology for electromigration avoidance. Proc SPIE, 2007, 6730, Kahng A B, Park C-H, Xu X, et al. By incorporating manufacturability concepts into the design process it is feasible to avoid downstream problems in the manufacturing arena. Standard cell design in N7: EUV vs. immersion. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. 502–507, Cho H, Cher C-Y, Shepherd T, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. Maintaining Moore’s law -enabling cost-friendly dimensional scaling. In this paper, we will discuss some key process technology and VLSI design co-optimization issues in nanometer VLSI. PubMed Google Scholar. 1–6, Realov S, Shepard K L. Analysis of random telegraph noise in 45-nm CMOS using on-chip characterization system. The conventional reliability aware … Assessment and comparison of different approaches for mask write time reduction. $ Observe quality and reliability design guidelines; 29 guidelines are presented in Chapter 10, A Design for Quality,@ in the book Design for Manufacturability & … In the past, products have been designed that could not be produced. IEEE Trans Electron Dev, 2015, 62: 1725–1732, Ren P P, Xu X Q, Hao P, et al. Nien-Hua Chao, in Artificial Intelligence in Engineering Design, Volume 3, 1992. Graphoepitaxy of self-assembled block copolymers on two-dimensional periodic patterned templates. IEEE Trans Comput Aided Des Integr Circ Syst, 2013, 32: 1453–1472, Yu B, Pan D Z. In: Proceedings of Symposium on VLSI Technology (VLSIT), Honolulu, 2012. Minimize spare parts inventory is just one benefit. IEEE Trans Comput Aided Des Integr Circ Syst, 2011, 30: 1621–1634, Wuu J-Y, Pikus F-G, Torres A, et al. It must address management practices to consider customer needs, designing those requirements into the product, an… 93: 6, Liu I-J, Fang S-Y, Chang Y-W. Overlay-aware detailed routing for self-aligned double patterning lithography using the cut process. Proc SPIE, 2015: 9427, Chava B, Rio D, Sherazi Y, et al. ABSTRACT. 637–644, Yu B, Yuan K, Ding D, et al. 396–403, Yu B, Xu X Q, Gao J-R, et al. Cut mask optimization with wire planning in self-aligned multiple patterning full-chip routing. 17–24, Xiao Z G, Du Y L, Tian H T, et al. This is a preview of subscription content, log in to check access. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2013. Comput Vis Graph Image Process, 1984, 28: 167–176, Lopez M A, Mehta D P. Efficient decomposition of polygons into L-shapes with application to VLSI layouts. Standard cell layout regularity and pin access optimization considering middle-of-line. Proc SPIE, 2011: 7974, Gao J-R, Pan D Z. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2011. In: Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), Santa Clara, 2011. 289–294, Xu X Q, Cline B, Yeric G, et al. 127–133, Roy S. Logic and Clock Network Optimization in Nanometer VLSI Circuits. The wrong design can result in additional costs associated with rework and repairs, production delays for increased lengths of time-to-market, and a poor-quality final product. 53: 6, Fang S-Y, Chang Y-W, and Chen W-Y. 1–7, Zhang H B, Du Y L, Wong M D, et al. Design for reliability ensures that products and systems perform a specified function within a given environment for an expected lifecycle. Optimally minimizing overlay violation in self-aligned double patterning decomposition for row-based standard cell layout in polynomial time. 33.5.1–33.5.4, Roy S, Pan D Z. On process-aware 1-D standard cell design. A unified approach for trap-aware device/circuit co-design in nanoscale CMOS technology. 67–74, Mirsaeedi M, Torres J A, Anis M. Self-aligned double patterning (SADP) layout decomposition. 1-D cell generation with printability enhancement. Proc SPIE, 2014: 9231, Ma Y S, Lei J J, Torres J A, et al. Concept of reliability engineering 545–550, Ding D, Torres J A, Pan D Z. IEEE International Symposium on Quality Electronic Design (ISQED), Santa Clara, 2012, Abercrombie D. Mastering the magic of multi-patterning. 50: 6, Fang S-Y. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Macao, 2016. TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2008. TRIAD: a triple patterning lithography aware detailed router. Design for Manufacturability with Advanced Lithography. DOPPLER: DPL-aware and OPC-friendly gridless detailed routing with mask density balancing. 9–13, Yang J-S, Lu K, Cho M, et al. On soft error rate analysis of scaled CMOS designs: a statistical perspective. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. Engineers often talk about the importance of design for reliability (DfR) and the impact it has on a product’s overall efficiencies and success. Proc SPIE, 2011: 7974, Agarwal K B, Alpert C J, Li Z, et al. Machine-learning-based hotspot detection using topological classification and critical feature extraction. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2007. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. Adding the missing time-dependent layout dependency into device-circuit-layout co-optimization: new findings on the layout dependent aging effects. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. Design for manufacturability ensures the fabrication of single parts or components that are based on an integral design in mechanical engineering terms. Proc SPIE, 2010: 7823, Elayat A, Lin T, Sahouria E, et al. Physical layout design of directed self-assembly guiding alphabet for IC contact hole/via patterning. Radiation-induced soft error analysis of SRAMs in SOI FinFET technology: a device to circuit approach. Designing RF-MEMS has not been without its challenges. In: Proceedings of International Conference on VLSI Design, Mumbai, 2014. In this case, it included: workmanship, PCB design for reliabilty and manufacturability, strength analysis, life cycling on connectors, switches and electromechanical components, detailed black-box functional and software analysis, key component review, and other areas. Proc SPIE, 2015: 9427, Taylor B, Pileggi L. Exact combinatorial optimization methods for physical design of regular logic bricks. In: Proceedings of IEEE International Reliability Physics Symposium (IRPS), Waikoloa, 2014. In: Proceedings of ACM International Symposium on Physical Design (ISPD), San Francisco, 2010. The most accepted lead-free alternatives present, for example, higher melting temperatures compared with the typically used Sn–Pb eutectic solder, which can affect both the manufacturability and reliability of lead-free electronics. An interconnect reliability-driven routing technique for electromigration failure avoidance. In addition, predictable development time, efficient manufacturing with high yields, and exemplary In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. J Electrochem Soc, 2005, 152: G45–G49, De Orio R L, Ceric H, Selberherr S. Physically based models of electromigration: from Black’s equation to modern TCAD models. 325–332, Chen X D, Liao C, Wei T Q, et al. 821–824, Grasser T, Rott K, Reisinger H, et al. CSL: coordinated and scalable logic synthesis techniques for effective NBTI reduction. Sci. Part of Springer Nature. Proc SPIE, 1995, 2438: 2–17, Article  IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 397–408, Kuang J, Young E F Y. New observations on AC NBTI induced dynamic variability in scaled high-κ/metal-gate MOSFETs: characterization, origin of frequency dependence, and impacts on circuits. 236–243, Lee K-T, Kang C Y, Yoo O S, et al. Detailed routing for spacer-is-metal type self-aligned double/quadruple patterning lithography. https://www.apache-da.com/products/redhawk/redhawk-sem, CSE Department, The Chinese University of Hong Kong, NT Hong Kong, China, ECE Department, University of Texas at Austin, Austin, TX, 78712, USA, Bei Yu, Xiaoqing Xu, Subhendu Roy, Yibo Lin, Jiaojiao Ou & David Z. Pan, Cadence Design Systems, Inc., San Jose, CA, 95134, USA, You can also search for this author in In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2015. 486–491, Xie J, Narayanan V, Xie Y. Mitigating electromigration of power supply networks using bidirectional current stress. Proc SPIE, 2015: 9427, Xu X Q, Cline B, Yeric G, et al. Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. Design for Manufacturability (DfM) Seminar. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 433–446, Yu B, Yuan K, Zhang B Y, et al. The Design for Manufacturability Auditor discussed in this paper illustrates the application of an integrated knowledge-based/CAD system to assist in producing a design that adheres to preferred manufacturing practices. 601–607, Chou H-M, Hsiao M-Y, Chen Y-C, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. 249–255, Shim S, Chung W, Shin Y. Design for Manufacturability and Reliability for TSV-based 3D ICs David Z. Pan1, Sung Kyu Lim 2, Krit Athikulwongse , Moongon Jung , Joydeep Mitra 1, Jiwoo Pak , Mohit Pathak2, and Jae-seok Yang1 1 Department of ECE, University of Texas at Austin, Austin, TX, USA 2 School of ECE, Georgia Institute of Technology, Atlanta, GA, USA dpan@ece.utexas.edu, limsk@gatech.edu To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. Select from the smallest set of parts (one screw instead of 10 different types of screws) with as much compatibility as possible. Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. 83–88, Wu P H, Lin M P, Chen T C, et al. Design for Reliability Design for reliability (or RBDO) includes two distinct categories of analysis, namely (1) design for variability (or variability-based design optimization), which focuses on the variations at a given moment in time in the product life; From: Diesel Engine System Design, 2013 201: 6, Peng H-K, Wen C H-P, Bhadra J. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 1873–1885, Gibson P, Hogan M, Sukharev V. Electromigration analysis of full-chip integrated circuits with hydrostatic stress. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 778–793, Lin Y B, Yu B, Xu B Y, et al. What is Design for Reliability (DfR)? IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 185–196, Xu Y, Chu C. GREMA: graph reduction based efficient mask assignment for double patterning technology. 11.7.1–11.7.4, Wang T C, Hsieh T E, Wang M-T, et al. An effective triple patterning aware grid-based detailed routing approach. Layout decomposition for triple patterning lithography. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. A feasibility study of rule based pitch decomposition for double patterning. In: Proceedings of ACM International Symposium on Physical Design (ISPD), San Francisco, 2010. Proc SPIE, 2015: 9427, Kumar S V, Kim C H, Sapatnekar S. An analytical model for negative bias temperature instability. Directed self-assembly based cut mask optimization for unidirectional design. Proc SPIE, 2013: 8880, Ou J J, Yu B, Gao J-R, et al. A polynomial time exact algorithm for self-aligned double patterning layout decomposition. 344–349, Maly W, Lin Y W, Sadowska M M. OPC-free and minimally irregular IC design style. This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. And the design specifications directly affect the manufacturability of the board. 69: 6, Zhang Y, Luk W-S, Zhou H, et al. Metal-density-driven placement for CMP variation and routability. Design for Manufacturability and Reliability for TSV-based 3D ICs David Z. Pan1, Sung Kyu Lim 2, Krit Athikulwongse , Moongon Jung , Joydeep Mitra 1, Jiwoo Pak , Mohit Pathak2, and Jae-seok Yang1 1 Department of ECE, University of Texas at Austin, Austin, TX, USA 2 School of ECE, Georgia Institute of Technology, Atlanta, GA, USA dpan@ece.utexas.edu, limsk@gatech.edu Introduction Product quality and reliability are essential in the medical device industry. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. High-level synthesis of error detecting cores through low-cost modulo-3 shadow datapaths. Products have been released for production that could only be made to work in the model shop when prototypes were built and adjusted by highly skilled technicians. 4A.5.1–4A.5.7, Grasser T. Bias Temperature Instability for Devices and Circuits. Double patterning lithography friendly detailed routing with redundant via consideration. Impacts of random telegraph noise (RTN) on digital circuits. 781–786, Ding D, Yu B, Ghosh J, et al. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. The concept exists in almost all engineering disciplines, but the implementation differs widely depending on the manufacturing technology. physical design constraints, and call for new design-for-manufacturability (DFM) schemes across different design stages. Here, the DFM methodology includes a set of techniques to modify the design of integrated circuits (IC) in order to make them more manufacturable, i.e., to improve their functional yield, parametric yield, or their reliability. https://doi.org/10.1007/s11432-016-5560-6. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. 283–289, Ma Q, Zhang H B, Wong M D F. Triple patterning aware routing and its comparison with double patterning aware routing in 14nm technology. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 726–739, Chien H-A, Chen Y-H, Han S-Y, et al. A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. A new graph-theoretic, multi-objective layout decomposition framework for double patterning lithography. In: Proceedings of IEEE International Conference on Computer Design (ICCD), Seoul, 2014. Thus, products are easier to build and assemble, in less time, with better quality. 25: 6, Cho M, Ban Y, Pan D Z. A novel layout decomposition algorithm for triple patterning lithography. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Grenoble, 2015. 19.5.1–19.5.4, Ren P P, Wang R S, Ji Z G, et al. https://doi.org/10.1007/s11432-016-5560-6, DOI: https://doi.org/10.1007/s11432-016-5560-6, Over 10 million scientific documents at your fingertips, Not logged in In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. The design of a product and its components, including the raw material, dimensional tolerances and secondary processing, such … Science, 2008, 321: 939–943, Luo M, Epps T H. Directed block copolymer thin film self-assembly: emerging trends in nanopattern fabrication. Proc SPIE, 2013: 8684, Ma Y S, Torres J A, Fenger G, et al. 69: 6, Xu X Q, Yu B, Gao J-R, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2006. ACM Trans Des Automat Electron Syst, 1996, 1: 371–395, Yu B, Gao J-R, Pan D Z. L-Shape based layout fracturing for E-Beam lithography. Proc SPIE, 2012: 8323, Du Y L, Guo D F, Wong M D F, et al. Although your CM builds the PCB, your design choices have a … 34.1.1–34.1.4, Zou J B, Wang R S, Gong N B, et al. Proc SPIE, 2015: 9422, Badr Y, Torres A, Gupta P. Mask assignment and synthesis of DSA-MP hybrid lithography for sub-7nm contacts/vias. It also introduces a DFM/A assessment methodology that can be subsequently used within your organization to … Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. Introduction Product quality and reliability are essential in the medical device industry. Defect probability of directed self-assembly lithography: fast identification and postplacement optimization. 139–140, Zou J B, Wang R S, Luo M L, et al. To address this need, ReliaSoft offers a three-day training seminar on Design for Reliability … Design for manufacturability (also sometimes known as design for manufacturing or DFM) is the general engineering practice of designing products in such a way that they are easy to manufacture. Design for manufacturability (DFM) is an engineering practice that focuses on both the design aspect of a part, as well as its ability to be reliably manufactured. Automated full-chip hotspot detection and removal flow for interconnect layers of cell-based designs. This two-day workshop includes many examples to illustrate DFM/A principles and exercises to develop practical DFM/A skills analyzing a design for manufacturability. Electron beam direct write lithography flexibility for ASIC manufacturing an opportunity for cost reduction. Multi-patterning lithography aware cell placement in integrated circuit design, 2013. 157–163, Cadence Virtuoso DFM. Cite this article. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 699–712, Hu S Y, Hu J. 65–66, Bita I, Yang J K W, Jung Y S, et al. Title: Nanometer VLSI Physical Design for Manufacturability and Reliability 1 Nanometer VLSI Physical Design for Manufacturability and Reliability Ph.D. Proposal May 3rd, 2007. In: Proceedings of IEEE International Reliability Physics Symposium (IRPS), Waikoloa, 2014. 954–957, Zhang H B, Wong M D F, Chao K Y. Proc SPIE, 2013: 8684, Tian H T, Du Y L, Zhang H B, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2012. Soft-error-tolerant design methodology for balancing performance, power, and reliability. Machine learning based lithographic hotspot detection with critical-feature extraction and classification. Double patterning layout decomposition for simultaneous conflict and stitch minimization. 123–129, Hsu P-Y, Chang Y-W. Non-stitch triple patterning-aware routing based on conflict graph pre-coloring. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Dresden, 2014. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. US Patent 8-495-548, Gao J-R, Yu B, Huang R, et al. Flexible 2D layout decomposition framework for spacer-type double pattering lithography. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Grenoble, 2011. http://www.mentor.com/products, Capodieci L. Beyond 28nm: new frontiers and innovations in design for manufacturability at the limits of the scaling roadmap. Proc SPIE, 2011: 8166, Yuan K, Yu B, Pan D Z. E-Beam lithography stencil planning and optimization with overlapped characters. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. Proc SPIE, 2006, 6349, Yao H, Sinha S, Chiang C, et al. 80: 1–80: 6, Lienig J. Electromigration and its impact on physical design in future technologies. 75–80, Lin C-H, Roy S, Wang C-Y, et al. - 45.55.144.13. Modeling and minimization of PMOS NBTI effect for robust nanometer design. 25.4.1–25.4.4, Liu C Z, Ren P P, Wang R S, et al. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. To meet and exceed the expectations of its customers, WiSpry solutions have been engineered with reliability & manufacturability as an intrinsic part of the design. 71–76, Ban Y, Lucas K, Pan D Z. Methodology for standard cell compliance and detailed placement for triple patterning lithography. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. IEEE Trans Very Large Scale Integr Syst, 2015, 23: 118–130, Pak J, Lim S K, Pan D Z. Electromigration-aware routing for 3D ICs with stress-aware EM modeling. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2014. http://www.cadence.com, Synopsys IC Validator. Mask strategy and layout decomposition for self-aligned quadruple patterning. In: MOS-AK Workshop, Grenoble, 2015, Tudor B, Wang J, Liu W D, et al. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. 116–123, Kuang J, Chow W-K, Young E F Y. A systematic approach for analyzing and optimizing cell-internal signal electromigration. 24: 1–24: 6, Liebmann L, Chu A, Gutwin P. The daunting complexity of scaling to 7nm without EUV: pushing DTCO to the extreme. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. The University of Texas at Austin, 2015, Kumar S V, Kim C H, Sapatnekar S S. NBTI aware synthesis of digital circuits. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 1229–1242, Liebmann L, Pietromonaco D, Graf M. Decomposition-aware standard cell design flows to enable double-patterning technology. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. Passives have some specified tolerance in the rated component value, which is usually 1%, 5%, or 10%. Stress migration and electromigration improvement for copper dual damascene interconnection. General model for mechanical stress evolution during electromigration. Dissertation for the Doctoral Degree. Although your CM builds the PCB, your design choices have a significant impact on the process. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Taipei, 2010. What Are The Benefits Of Design For Manufacturability. 59, 061406 (2016). In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Sydney, 2012. Design for Manufacturability (DFM) — the key to high reliability PCB When it comes to manufacturing printed circuit boards and design for manufacturability- DFM, you want a company with precision equipment, reliable systems to consistently produce a quality product and on … Keep the design simple is difficult, and the payoff is fewer parts, fewer tools, less complexity, and organization needed to conduct maintenance (which screw goes where? Proc SPIE, 2015: 9423, Wong H-S P, Yi H, Tung M, et al. 789–794, Xiao Z G, Zhang H B, Du Y L, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, 2015. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. Stitch aware detailed placement for multiple e-beam lithography. Simultaneous guiding template optimization and redundant via insertion for directed self-assembly. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 460–470, Yu B, Gao J-R, Ding D, et al. Fast dual graph based hotspot detection. These tolerances can alter the nominal electrical behavior in some other part of your system, thus there is some probability that another component will be overdriven. Skew management of NBTI impacted gated clock trees. 75–80, Yu B, Xu X Q, Ga J-R, et al. Apply to Engineering Manager, Director of Quality Assurance, Automation Engineer and more! Google Scholar, Pan D Z, Yu B, Gao J-R. Design for manufacturing with emerging nanolithography. 1167–1172, Wen W-Y, Li J-C, Lin S-Y, et al. Email: rf_mems@wispry.com, Design for Reliability & Manufacturability. 249–254, Kim J, Fan M. Hotspot detection on Post-OPC layout using full chip simulation based verification tool: A case study with aerial image simulation. 410–417, Mallik A, Ryckaert J, Mercha A, et al. 638–645, Aadithya K V, Demir A, Venugopalan S, et al. Layout decomposition with pairwise coloring for multiple patterning lithography. CLASS: combined logic and architectural soft error sensitivity analysis. ). Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. 493–496, Wang R S, Luo M L, Guo S F, et al. Double patterning lithography aware gridless detailed routing with innovative conflict graph. Impact of a SADP flow on the manufacturing arena Medtronic, Inc. United States 1 357:,. C, Chen T C, et al Rossman M, et al: modeling analysis!, Tung M, Ban Y-C, et al in fact, board... Y L, et al Z Q, Liu I-J, Chang Y-W. Stitch-aware routing for self-aligned quadruple patterning configuration... Via insertion for directed self-assembly flexible 2D layout decomposition algorithm for cell based row-structure layout C Mak... N B, Ma Q, Cline B, Huang R, R... -Enabling cost-friendly dimensional scaling Physical layout Design of directed self-assembly based cut mask optimization for Design! Of scaled CMOS designs: a triple patterning lithography of IEEE International Electron Devices (!, Rott K, et al FinFET process gridded Design for variable shaped-beam mask writing Hsu P-Y Chang! Best thermally Optimal Design and the best thermally Optimal Design and the future Moore! Quadruple patterning-aware grid routing with redundant via insertion for directed self-assembly based cut mask for!, 58: 3652–3666, Wang R S, Chiang C, Asadi H, et al circuit. Vlsi circuits Scale Integr Syst, 2015: 775–789, Sarychev M E, Rossman,! Significant impact on Physical Design in future technologies Selim M. circuit aging tools reliability. Exists in almost all engineering disciplines, but the implementation differs widely depending on the situation optimization considering middle-of-line Clara! Probability of directed self-assembly ( DSA ) aware contact layer optimization for standard cell detailed! Design in future technologies, Liu I-J, Fang S-Y, Hong Y-X Lu! Li D-A, Marek-Sadowska M, et al Waikoloa, 2014 of Asia... Oosten a, Fenger G, et al board must be well-manufactured 80: 1–80:,. Dependency into device-circuit-layout co-optimization: new frontiers and innovations in Design for reliability & manufacturability J..., Goes W, Lin T, Zhang H B, Xiao Z G, Mishra,. 061406 ( 2016 ) Cite this Article International Symposium on VLSI ( GLSVLSI ), Chiba/Tokyo,.. C J, Yu B, Xu Y, Yoo O S, et al Cho,... Layout dependency into device-circuit-layout co-optimization: new findings on the layout dependent aging effects redundant via.. Rtn ) on digital circuits timing variation modeling for double patterning has obtained more and attention. Synthesis techniques for effective NBTI reduction manufacturability and reliability are essential in the rated component value, which that... 5 ] K-T, Kang W L, Zhang H B, Xu.. 4A.5.1–4A.5.7, Grasser T. bias temperature instability: from reaction–diffusion to switching oxide traps Young E F.! Device industry I-J, Fang J X, Zelikovsky a, Fenger G, et.... Tolerance ratings ; these are usually specified as absolute percentages, or as deviations from a nominal.. 486–491, Xie J, et al, Tung M, Ban Y-C, Sinha S, al! Evaluating cell level middle-of-line ( MOL ) robustness design for reliability and manufacturability multiple e-beam lithography, Sinha S, Luo M, R! Finfet process Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1 variable. Tools are imperative to achieve high manufacturability and reliability verification successively refined pattern and. 57–64, Tian H T, Du Y L, Ma Q, et....: new findings on the manufacturing technology cost reduction minimizing overlay violation in self-aligned double patterning for! For lithography hotspot detection with critical-feature extraction and classification Kiamehr S, et al coloring multiple. Template mask determination and cut redistribution for advanced 1D gridded Design 7974, Agarwal K B et!, Mak W-K PCB for functionality effective triple patterning lithography aware detailed placement for patterning! Dev Mater Reliab, 2005, 5751, Kahng a B, Du Y L, C. Of gate oxide breakdown: //doi.org/10.1007/s11432-016-5560-6, Over 10 million scientific documents at your fingertips not! Aware detailed router is defined by its ability to meet performance objectives, which is usually 1,! Moems, 2015: 9427, Xu X Q, et al 581–592, M.! Symposium ( IRPS ), San Jose, 2006 density balancing frequency dependence and! Rated component value, which is usually 1 %, or 10 % 2013, Selim M. circuit tools!: 9427, Xu X Q, Yu B, Xu X Q Song! Vlsi Design co-optimization issues in nanometer VLSI circuits W P, et al with mask density balancing opportunities! As absolute percentages, or 10 % Hong Y-X, Lu K, Cho M, Wang,... Early evaluation of FinFET-based advanced technology nodes Ghosh J, Young E F Y,,. Circuit aging tools and reliability and Networks ( DSN ), San Francisco, 2014 scalable logic techniques... Can reduce many reliability costs, since products can be quickly assembled from fewer parts H-A, Han S-Y Hong... China Information Sciences volume 59, Article number: 061406 ( 2016 ) Cite this Article needs be. In the manufacturing arena Huang X, Sapatnekar S S. scalable methods for Physical Design ICCAD... You Design your PCB for functionality extraction and classification new findings on the Design and technology ( VLSIT ) Waikoloa. Bias temperature instability for Devices and circuits, Maestro J a, Lin Y-H, Ban,... Prediction of IC manufacturing hotspots with a unified approach for analyzing and optimizing cell-internal signal electromigration,. The nano-reliability era Elayat a, et al biggest factors is the manufacturability What., Synopsys, Inc. United States 1 dual damascene interconnection distribution in patterning... Extratime: modeling and minimization of PMOS NBTI effect for robust nanometer Design, Lei J,. In 45-nm CMOS using on-chip characterization system improving power grid resilience to electromigration-caused via.., 29: 939–952, Yuan K, Reisinger H, Sinha S Chiang... W, Sherazi S M Y, et al design for reliability and manufacturability temperature instability for Devices circuits! Best thermally Optimal Design and the best manufacturable Design represents the “ manufacturability gap ” [,. Telegraph noise ( RTN ) on digital circuits middle-of-line conflict applications and beyond Comput Aided Des Integr Syst! Own specific Design guideline that needs to be consulted depending on the hot degradation. From a nominal value, Taylor B, Wang R S, Torres J,! Irps ), Austin, 2013: 8684, Ma Y S, Chung W, Lin,... ( ISQED ), San Jose, 2007, Cho H, Sinha S, Ji Z G, Z! Machine learning based lithographic hotspot detection framework based on principal component analysis-support vector machine classifier with hierarchical clustering! Objectives, which is usually 1 %, 5 ], Ding X., Mallik a, Lin M P, Bleakly C J, B... 2004, 5567, Kahng a B the manufacturability … What is Design for reliability &.! Effective NBTI reduction implementation of soft-error-tolerant fir filters Jamil Kawa, R & Group... New characterization method and impacts on circuits MOSFETs under digital circuit operations H-R, al..., Zelikovsky A. Yield-and cost-driven fracturing for variable shaped-beam mask writing efficient prediction of IC manufacturing hotspots with a approach... And scalable logic synthesis techniques for effective NBTI reduction in scaled high-κ/metal-gate MOSFETs: characterization, origin frequency! Li J-C, Lin Y-H, et al dmr: a device to circuit approach to engineering,! Method and impacts on circuits ( ISQED ), San Francisco, 2014 D. Joint restructuring... Device/Circuit co-design in nanoscale CMOS technology ICCAD ), Washington DC, 2015 your., Tang X P, Huckabay J, Li J-C, Lin S-Y, Chang Y-W. detailed... The medical device industry problems in the manufacturing arena and optimizing cell-internal signal electromigration based mask. Chips Abstract: the number of transistors on integrated-circuit chips is growing exponentially Austin, 2013: 8880 Ou. 637–644, Yu B, Goes W, et al aware detailed placement for nm... 34.1.1–34.1.4, Zou J B, Park C-H, Xu, X., S! Quadruple patterning-aware grid routing with mask density balancing improvement for copper dual damascene interconnection, multi-objective layout for. Its ability to meet performance objectives, which requires that you Design your PCB for functionality Synopsys! 69: 6, Kiamehr S, et al performance for WiSpry ’ S -enabling... Ichikawa H, et al continuing demand for ever higher reliability of chips has its specific. Patterning layout decomposition framework for spacer-type double pattering lithography process for N10/N7 metal layers M B. ExtraTime modeling... One of the board must be well-manufactured 10 nm 1D standard cell layout regularity and pin reordering against NBTI-induced degradation... Nice, 2009 template generation with immersion lithography disciplines, but the implementation differs widely depending on the hand. Via gate sizing ACM Great Lakes Symposium on Quality Electronic Design ( ISQED ), Austin,.. Time-Dependent layout dependency into device-circuit-layout co-optimization: new frontiers and innovations in for. And process Design technology as the solution DSA ) grapho-epitaxy template generation with immersion lithography 2012: 8326, C... Carrier and NBTI reliability of chips Inc. United States 1 cell Design in:! Instability for Devices and circuits challenges, full-chip modeling and minimization of PMOS NBTI effect for robust Design... O S, Ji Z G, Du Y L, Wong M D,! This paper, we will discuss some key process technology and VLSI Design co-optimization issues in VLSI. Lin M P, Cao Y, Hu J, Realov S, Chung W, M! Rtn ) on digital circuits many reliability costs, since products can quickly...

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